Hanmi Semiconductor
HBM is a high-performance memory used in artificial intelligence (AI), and is a semiconductor that has recently been increased in demand along with AI. According to the industry on the 26th, HANMI Semiconductor is developing a new equipment called, ‘New Dual TC Bonder’.
[News] Hanmi Semiconductor to Launch 2.5D TC ... - TrendForce …
Jul 9, 2024 · To further gain market momentum, South Korean chip packaging equipment manufacturer Hanmi Semiconductor plans to launch 2.5D big die TC bonder models in the second half of 2024, while increasing its annual sales target for this year to 650 billion won (USD 471 million), according to the latest report by the Korea Economic Daily.
HANMI Semiconductor
Apr 1, 2024 · According to a recent Hyundai Motor Securities report, it is expected that the U.S. demand for DUAL TC BONDER of HANMI Semiconductors for HBM production, which is the core of AI semiconductors, will be keep increasing.
TC Bonder Line Up from HANMI Continues to Grow - NDC …
Dec 29, 2023 · On September 19th HANMI announced that the third-generation DUAL TC BONDER GRIFFIN was released. Vice Chairman, DS Kwak, said that this bonder offers “significant improvement in productivity and precision for stacking semiconductor chips for next-generation HBM production.”
HANMI Semiconductor : released ‘TC BONDER’ after 6 years and s..
Dec 24, 2021 · HANMI Semiconductor released 'TC BONDER' after 6 years and supply to a global company. [edaily reporter Kang Kyung-rae] HANMI Semiconductor (042700) announced on the 23rd that they released TC BONDER 2.0CS for the first time in 6 years and supplied to global semiconductor companies.
HANMI Semiconductor
An official from HANMI Semiconductor said, “The TC BONDER CW equipment, which is introduced for the first time through this SEMICON Taiwan exhibition, is a 2.5D packaging bonder that attaches artificial intelligence GPUs and HBM semiconductors to silicon interposers.”
HANMI’s TC Bonder Line Continues Expansion - Neu Dynamics …
Dec 29, 2023 · On September 19th HANMI announced that the third-generation DUAL TC BONDER GRIFFIN was released. Vice Chairman, DS Kwak, said that this bonder offers …
HANMI Semiconductor launch its new semiconductor equipment …
Sep 8, 2023 · The DUAL TC BONDER 1.0 DRAGON, a second-generation model of crucial High-Bandwidth Memory (HBM) process equipment for artificial intelligence (AI) semiconductors, was just released by HANMI Semiconductor.
한미테크윈 - hanmitw.com
TCBⅡ series developed by HANMI TECHWIN is a type of reducing maintenance problems, the old model has been containing seriously . On its stop condition, the electric power left in magnetic brake coil is fed back into the line and by doing so, promotes the efficiency of controller.
Top 5 TCB Bonder Manufacturers, 2022 - Business Research Insights
Jul 19, 2022 · HANMI Semiconductor Co., Ltd. produces and creates semiconductor equipment. The company's portfolio involves auto molding system, sawing & placement system, compress trim/form/singulation system as well as pick & place system.
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