Analyst Ben Bajarin is estimating that TSMC’s 3nm wafers are running Apple about $18,000 a pop. Apple uses the 3nm process ...

By stacking III–V layers (multijunction cells), solar cells achieve higher efficiency compared to silicon-based cells ... which reduce voltage. Plasma dicing, especially with hydrogen, minimizes ...

A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has ...

This grant aims to dramatically increase the production of silicon wafers in the United States, with projects slated for Texas and Missouri. These plans will facilitate the first high-volume U.S.

The US commerce department said on Tuesday it has finalized $406 million in government grants to Taiwan's GlobalWafers to significantly increase production of silicon wafers in the United States. ET ...

GlobalWafers Co., a Taiwanese maker of silicon wafers used in chip manufacturing, finalized a deal to receive as much as $406 million in awards from the US Chips and Science Act to help build ...

The U.S. Department of Commerce has finalized up to $406M in funding for Taiwanese company GlobalWafers as part of the U.S. CHIPs Act to ramp up domestic silicon wafer production. The company had ...

The billionaires of Silicon Valley aren’t done playing nice with Donald Trump. They’re now showering him with pleasantries, well wishes, and wads of cash. The next day, Amazon confirmed that ...

Although die thickness is currently the primary challenge, semiconductor companies are exploring silicon wafer thicknesses below 50 µm, potentially reaching the capability of blade dicing. Issues such ...

Arm, headquartered in the U.K. and majority-owned by SoftBank Group, claims QCOM's NUVIA deal requires renegotiation. Qualcomm vs. Arm underscores the intense world of IP, pitting customer against ...

The YES RapidCure tool, based on an exclusive license to the process created by Deca Technologies, is a combination of UV and direct thermal exposure that significantly reduces process cycle time ...