Although die thickness is currently the primary challenge, semiconductor companies are exploring silicon wafer thicknesses below 50 µm, potentially reaching the capability of blade dicing. Issues such ...
One of LPC’s flagship products in this space is the BlackStar laser wafer dicing and scribing system ... to separate brittle materials like silicon. This technique greatly improves die yield ...
the BlackStar helps maximize die yield per wafer and minimize material loss. Equipped with a short-pulse laser, this technology addresses silicon dicing challenges like impact damage and thermal ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback