Under this agreement, Ambarella will utilize Qualitas C/D-PHY IP, implemented on the 5nm process, to apply it to its ...
With advanced NoC tools, SoC designers will be able to address escalating design requirements with greater efficiency.
Enhances Keysight’s EDA standards-based approach, enabling high-speed digital chiplet design tailored for AI and data center ...
2d
Quintessent Inc., a pioneer in quantum dot laser technology and heterogeneous silicon photonics, and IQE plc, the leading ...
BlueLynx PHY solutions support Universal Chiplet Interconnect Express (UCIe) and the Open Compute Project (OCP) Bunch of Wires (BoW) interfaces. An optional link layer connects to on-die ...
Across technology, manufacturing, health care, retail, corporate office and more, the Phoenix Business Journal selected the ...
Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.
Q4 2024 Earnings Call Transcript January 22, 2025 Operator: Hello, and welcome to the Fourth Quarter Earnings Conference Call ...
tom's Hardware on MSN13h
BOE reportedly mulls producing glass substrates for China's CPUs — new focus on semiconductorsBOE, a leading Chinese manufacturer of LCD and OLED displays, is considering making glass core substrates for next-gen ...
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