Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.

US memory chip manufacturer Micron is planning to spend US$2.17 billion to expand and modernize its wafer fab at Manassas, ...

A new graphene-based interconnect technology developed by Destination 2 promises to help ICs overcome the limitations imposed ...

TSMC introduced "Wafer Manufacturing 2.0" in July 2024, integrating packaging, testing, and photomask production into its ...

The Biden-Harris Administration has imposed export controls and technology restrictions on China's advanced chip sector from ...

Research from the Chin-Yi University of Technology in Taiwan revealed a novel heater design in the Czochralski silicon ...

GCL-Poly Energy Holdings (HK:3800) has released an update.Don't Miss Our Christmas Offers:Discover the latest stocks recommended by top Wall ...

Littelfuse, Inc. (NASDAQ: LFUS), a diversified industrial technology manufacturing company empowering a sustainable, connected, and safer world, today announced it completed the acquisition of the ...

"We are delighted to be an anchor customer of YES's RapidCure technology, which will be critical in reducing cycle times of curing processes, allowing SkyWater to offer faster prototyping services ...