Although die thickness is currently the primary challenge, semiconductor companies are exploring silicon wafer thicknesses below 50 µm, potentially reaching the capability of blade dicing. Issues such ...

Researchers develop record-breaking solar cells with 2.39V open-circuit voltage, optimized for concentrated photovoltaics ...

The funding, which includes an additional $350 million in loans from the CHIPS Program Office, supports Bosch’s $1.9 billion project to expand its Roseville, California, facility for silicon ...

2.5D interposer materials In 2.5D packaging, different chiplets are interconnected horizontally through interposers, with three main materials are being considered: silicon (Si), organic ... Cu-Cu ...

It also provides etch, plasma dicing, deposition, and other wafer processing technologies and solutions ... It provides Ethernet switching and routing custom silicon solutions, optical and copper ...

Monday 18 November 2024 SK Siltron secures US$544 million loan to support SiC wafer production SK Group's silicon wafer manufacturer SK Siltron has confirmed that it will receive a loan of US$544 ...

REC Silicon is shutting a polysilicon plant in Moses Lake, Washington, that has struggled to achieve customers’ quality requirements. The plant is one of only a few in the US that manufactures the ...