BOE, a leading Chinese manufacturer of LCD and OLED displays, is considering making glass core substrates for next-gen ...

Harwin has announced the expansion of its Kontrol range of industrial board-to-board interconnects (BBi), adding single-row connectors and cables to the 1.27mm pitch (0.05″) connectors. The range has ...

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.

Introduces support for the latest interconnect standards, including Universal Chiplet Interconnect Express™ (UCIe™) 2.0 and ...

SEBASTOPOL, CA / ACCESSWIRE / January 15, 2025 / Luma Optics, the North American leader in AI-driven optical interconnect solutions, has unveiled ...

With these proven & unique technologies, OIC enables customers to reduce SoC’s backbone area (& global wires) by almost half while satisfying SoC’s high bandwidth and low latency demand. OIC’s ...

enables the formation of multiple layers of 2D graphene films on semiconductor products. It has the potential to significantly cut resistive losses occurring within devices’ interconnect layers ...

Abstract: In a chiplet IC, several dice are integrated through die-to-die interconnects. Technical challenges still exist for the repair of these die-to-die interconnects to boost the overall ...

Aitomatic, in collaboration with the AI Alliance, has introduced SemiKong-a first-of-its-kind open-source AI model specifically designed to transform the semiconductor industry. Built on Meta’s Llama ...

who are forming strategic partnerships and developing specialized technologies like SerDes and Universal Chiplet Interconnect Express to gain footholds in the technology-driven sector. Industry ...