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Semiconductor Engineering
1d
Laser Ablation Dicing Revolutionizes Ultra-Thin Wafer Saws Beyond The Capability Of Blade Dicing
Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.
1d
Femtosecond lasers and ordered nanopillars: A new path for high-speed electron control
The Tata Institute of Fundamental Research, Mumbai, in collaboration with the Australian National University, Canberra has ...
5d
New US laser drives electrons to record 10 billion electronvolts in 11.8 inches
US scientists achieve a groundbreaking 10 GeV electron acceleration in just 30 cm using a novel dual-laser and supersonic gas ...
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