A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has ...

BANGKOK (AP) — The Biden administration plans to raise tariffs on solar wafers, polysilicon and some tungsten products from China to protect U.S. clean energy businesses. The notice from the U.S ...

“Using this nozzle has been proven to strongly reduce nanoscale contamination on the surface of wafers. We are constantly updating the technology through joint research with semiconductor device ...

Execs said the company must prioritize efficiency over "no wafer left behind." Intel has lost ground to Nvidia, Samsung, and several Taiwanese and American players. Intel has said it needs to be ...

CA About BlackStar Laser Wafer Dicer Powered by Fantom Width Laser Dicing (FWLD) technology, the BlackStar helps maximize die yield per wafer and minimize material loss. Equipped with a short ...

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According to research firm Astute Analytica, the global push towards digitalization, coupled with rising demand for consumer electronics and miniaturization, is expected to boost the global wafer ...

This study fabricates a 45 ± 2° etching-free micro-mirror at the wafer level using dicing and e-beam metal evaporation methods. The root-mean-square (RMS) surface roughness of Au-deposited diced ...

In a market very disputed with STMicroelectronics and Bosch, InvenSense is still at the leading edge technically by providing 6Axis IMU with a high level of integration. With a package size of 3x3mm ...