Europe's Imec.xpand is spinning out memory chip firm Vertical Compute in a seed investment round worth $20.5 million.
TL;DR: SK hynix will showcase its new 16-Hi HBM3E memory chips at CES 2025, featuring up to 48GB capacity. These chips use an advanced manufacturing process to enhance performance and control warpage.
EAST FISHKILL, N.Y., Sept. 18, 2009-- IBM has successfully developed a prototype of the semiconductor industry's smallest, densest and fastest on-chip dynamic memory device in next-generation, ...