Although die thickness is currently the primary challenge, semiconductor companies are exploring silicon wafer thicknesses below 50 µm, potentially reaching the capability of blade dicing. Issues such ...

Wafer dicing saws are used in the semiconductor manufacturing process to cut silicon wafers into individual chips. As the electronics industry continues to evolve, the need for precision cutting ...

Bernardette Kunert, scientific director at imec, commented, “Over the past years, imec has pioneered nano-ridge engineering, a technique that builds on SAG and ART to grow low-defectivity III-V ...