Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.

One of LPC’s flagship products in this space is the BlackStar laser wafer dicing and scribing system ... to separate brittle materials like silicon. This technique greatly improves die yield ...

the BlackStar helps maximize die yield per wafer and minimize material loss. Equipped with a short-pulse laser, this technology addresses silicon dicing challenges like impact damage and thermal ...