Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.
Fonon Well-Positioned To Capitalize on Wafer Dicing Market Growth With BlackStar Laser Dicing System
The success of wafer dicing is measured by the quality and yield of the separated chips and the overall efficiency of the process. Powered by Fonon’s patented Fantom Width Laser Dicing (FWLD) ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback